High quality supplier platform for in-depth certification of national battery industry product query system.
Service Phone:4000-110-181
Detailed Parameters
Detailed Instruction

Application Field

SMT/PCBA Package type:BGA、LGA、CSP、POP、SIP...
Defect type:Void、HIP、Insufficient、Bridge...
Semiconductor Package type:W/B、IC、F/C...
Defect type:Void、Open、Short、Sweep、Solder ball...
Other areas Battery, IGBT...

 

Function Features

 

  • 2D, 2.5D, 3D all in one Inline X-Ray Inspection System

  • Multiple Resolution Selected (Max. 6μm)

  • 130KV Closed Micro-focus X-Ray Generator

  • Real-time image with HD FPD Detector

  • 11 axis Linkage System

  • 360° Circular CT Image

  • Data Tracking and Reworking System Embedded

Technical Parameters and Specifications

System Summary
Footprint 1640(W)*2070(D)*1800(H)mm
Machine Weight ≈3450kg
Power Supply 220AC/50Hz
Power 5.5 kW
X-ray Leakage < 0.5µSv/h
Imaging System
Tube Type Closed
Max. Voltage 130kV
Detector FPD
Image Acquisition 2D/2.5D/3D
Inspection Area
Max. Inspection Area (M Size) 255*330mm
Max. Inspection Area (L Size) 440*550mm
Max.Inspection Area (XL Size) 610*1200mm
PCBA thickness 0.5~5mm
PCBA Craft side 5mm
PCBA warpage compensation ±2mm
Clearance Top 70mm
Clearance Bottom 40mm
* Specifications are subject to change without notice, All trademarks are the property of the system maker.