High quality supplier platform for in-depth certification of national battery industry product query system.
Login/Registion
Service Phone:4000-110-181
Application Field
SMT/PCBA | Package type:BGA、LGA、CSP、POP、SIP... Defect type:Void、HIP、Insufficient、Bridge... |
Semiconductor | Package type:W/B、IC、F/C... Defect type:Void、Open、Short、Sweep、Solder ball... |
Other areas | Battery, IGBT... |
Function Features
2D, 2.5D, 3D all in one Inline X-Ray Inspection System
Multiple Resolution Selected (Max. 6μm)
130KV Closed Micro-focus X-Ray Generator
Real-time image with HD FPD Detector
11 axis Linkage System
360° Circular CT Image
Data Tracking and Reworking System Embedded
Technical Parameters and Specifications
System Summary | |
Footprint | 1640(W)*2070(D)*1800(H)mm |
Machine Weight | ≈3450kg |
Power Supply | 220AC/50Hz |
Power | 5.5 kW |
X-ray Leakage | < 0.5µSv/h |
Imaging System | |
Tube Type | Closed |
Max. Voltage | 130kV |
Detector | FPD |
Image Acquisition | 2D/2.5D/3D |
Inspection Area | |
Max. Inspection Area (M Size) | 255*330mm |
Max. Inspection Area (L Size) | 440*550mm |
Max.Inspection Area (XL Size) | 610*1200mm |
PCBA thickness | 0.5~5mm |
PCBA Craft side | 5mm |
PCBA warpage compensation | ±2mm |
Clearance Top | 70mm |
Clearance Bottom | 40mm |
* Specifications are subject to change without notice, All trademarks are the property of the system maker. |